Synova LDS 300 M Laser MicroJet® machine

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

LMJ machines are able to perform dicing or scribing of brittle thin wafers, such as low-k wafers or compound wafers, multi-directional 2D-cutting providing engineers with the capability to create new chip shapes spanning T-cuts and circular designs with the same quality as standard die patterns.

Different laser sources (Green, UV, IR) can be integrated into LMJ systems to tackle future applications.

Synova’s LMJ systems are low-cost-of-ownership tools that demand very few consumables and no tool wear. The high-throughput capability especially for thin wafers combined with its nearly damage-free technology (no HAZ, chipping, no micro-cracks, no burrs, no deposition) allows customers to realize cost benefits by increasing yield.

Materials
Silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), low-K materials and coated materials such as Epoxy molded compound wafers

Operations
Multi-directional 2D-cutting, grooving, dicing, edge grinding