Synova LDGS 300 A Laser MicroJet® machine

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

LMJ machines are able to perform multi-directional 2D-cutting providing engineers with the capability to create new chip shapes spanning T-cuts and circular designs with the same quality as standard die patterns.

Different laser sources (Green, UV, IR) can be integrated into LMJ systems to tackle future applications.

Synova’s LMJ systems are low-cost-of-ownership tools that demand very few consumables and no tool wear. The high-throughput capability especially for thin wafers combined with its nearly damage-free technology (no HAZ, chipping, no micro-cracks, no burrs, no deposition) allows customers to realize cost benefits by increasing yield.

Materials Silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), low-K materials and coated materials such as Epoxy molded compound wafers

Operations Multi-directional 2D-cutting, grooving, dicing, edge grinding