Synova DCS 300 Laser MicroJet® machine

This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.

Materials:
Rough diamonds
Laboratory grown diamonds (CVD, HPHT)

Operations:
3-axis machine: Sawing, pie sawing, coring, slicing