Synova DCS 150 Laser MicroJet® machine

The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds.

Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.

Materials:
Rough diamonds
Laboratory grown diamonds (CVD, HPHT)

Operations:
3-axis machine: Sawing, coring, slicing